Hi Paul,
 
If you have the option than choose the package which your process can handle best.
Handling a component in a process doesn't stop at SMA. Think of Inspection & Repair.
You should be able to inspect and repair a board with a 0.5mm pitch BGA before allowing it on any design.
 
Implementing BGA's in your process is a bit scary in the beginning, but the components are less susceptible to "handling-damage".
Once the process is setup right you'll see less defects than with fine pitch QFP's.
 
Hope this helps a little in making up your mind.
 
 
 
Jowan Iven
 
Process Engineer
 
 
 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Black, Paul
Sent: vrijdag 7 maart 2003 0:23
To: [log in to unmask]
Subject: [TN] BGA vs. QFP

Hi Technetters,
 
Up until now, I have been spoiled in that the only BGA that I have had to deal with had a 1.25mm pitch. Now, for a new design, Engineering is giving me an option of a 64 pin BGA or QFP. Both have a pitch of 0.5mm; is the consensus to stick with the BGA? Are there any potential gotcha's?

Thank you,
Paul Black
Manufacturing Engineer
Kronos 

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