Hi
Carl,
Just
exactly what does this "claw" look like? We are having similar problems with
depaneling completed assemblies and need a good way to get them apart without
applying too much pressure by breaking them away from each other. We are
damaging small SMT caps and resistors that lie near the board edge. MUCH
rework!
The
first impression I got when I read your message below is that it may look like
a Bottle cap opener. Is this the case? I know you said it's good for low
volume separation so we may not be able to use it. We would use it pretty
heavily on a daily basis. Any further info you could provide would be great,
like a picture maybe? I have been on the Hepco web site and only find a
motorized depanelizing machine ("the Model 1200-1"). Doesn't look like what
you have...
Thanks,
-----Original Message-----
From: TechNet
[mailto:[log in to unmask]]On Behalf Of Carl VanWormer
I have a Hepco
1.5mm "claw" that works well for low volume separation of boards milled with
an 0.062 bit. It's much better than snapping them apart! I think
it cost me about $20.
-----Original Message-----
From:
TechNet [mailto:[log in to unmask]] On Behalf Of Rich
Lasko
Good afternoon
everyone,
I am looking for some
information on some manual depaneling tools. I have an assembly that has the
array borders routed with "breakaway tabs". However, during the depaneling
process the operator basically bends the array border back and forth to
"snap" off the border. Hepco
makes a depaneling "claw" but I have not seen it in action. Any other
thoughts on depaneling
tools?