For 75.00, you can be there ... almost....
jk
Learn right in the comfort of your office about...
Emerging Packaging Technologies featuring
SMTA vice president of technical programs
Dr. Ken Gilleo, Cookson general technologist.
THIS FRIDAY, April 4, from
11:30AM - 1:00PM (Eastern Time)
10:30AM - Noon (Central Time)
9:30AM - 11:00AM (Mountain Time)
8:30AM - 10:00AM (Pacific Time)
While some CSPs and all flip chips have achieved
the smallest device-dimensioned foot print possible,
innovators have invoked the 3rd dimension to stack
chips. Flex-based packaging has also gained
attention by losing height and shedding weight with
25-micron materials that produce lines and spaces
approaching but a few microns with vacuum-
deposited metal.
This presentation will review and update the exciting
Package Revolution, describing packages that were,
those that are and some that are only dreams... http://www.smta.org/education/presentations/presentations.cfm#emerging_technologies
PREVIOUS ATTENDEES' COMMENTS
With the economy where it is today, and training budgets
shrinking, it was nice to be able to attend this type of
discussion without travelling.
We thought that the forum was excellent, especially the
way that attendees could instantly submit questions via
email.
I appreciate your accommodating our registration at
such short notice.
I will attend again to try and stay current with today's
technologies.
I feel this program provided information that I can use
in my job on a regular basis.
Very good background information with a knowledgeable
presenter.
Getting the presentation in advance, so we had a chance
to familiarize with it, was great.
The opportunity of getting key people from the industry
talking is beneficial.
Logistics were great.
I like the idea of several people calling from a conference
room, since it initiates internal discussion, as well.
REGISTRATION
The cost for this on-line presentation is $75USD/$135USD
for SMTA members/non-members, and the price of an
individual membership is included in non-member registration.
Each registration is good for one active phone line for
as many site employees as can be accommodated by
your AV facilities.
After registration, dial-in information and presentation
URL's will be sent by email to participants within 48 hours
of the scheduled event.
Register securely from the On-line Presentations page
in the Education section of smta.org...
http://www.smta.org/education/presentations/presentations.cfm
EVENT FORMAT
This presentation will be broadcasted using telecon for the
audio and Web file downloads for the presentation materials.
Email hyperlinks will be available during the presentation to
submit questions directly to the instructor.
Depending on the number of attendees, a 10-15 minute
moderated audio Q&A discussion may be included.
ADDITIONAL ON-LINE RESOURCES
Take Advantage of Data on Your Desk Tops
Nearly 1300 full-length TECHNICAL ARTICLES
in the Knowledge Base...
http://www.smta.org/knowledge/knowledge.cfmON-LINE COURSES like publications with
multimedia animations, audio and testing...
http://www.smta.org/education/courses/courses.cfmUpcoming On-line Presentations
Tuesday, May 6, from 9:00AM - 10:30AM (Pacific Time),
MARK ZETTER of Venture Outsource Group will present
India as a Destination Source for EMS.
Tuesday, May 20, from 1:00PM - 2:30PM (Eastern Time),
JEAN-PAUL CLECH of EPSI, Inc. will present
Lead-free Solder Reliability Issues
Thursday, May 29, from 10:30AM - Noon (Pacific Time),
SMTA Testability Committee Chair
LOUIS UNGAR of A.T.E. Solutions will present
Examining the SMTA Testability Guidelines TP-101C
Still have QUESTIONS? Post them in the Q&A FORUM...
http://www.smta.org/forum/forum.cfm
Contact SMTA director of publications Jesse Katzman
at 952-920-7682 or reply directly to this email with any
further questions or concerns.
THANKS!
SMTA uses email to distribute notices about our
technical programs, events, and publications.
If you do not wish to be on the SMTA electronic
mailing list please reply to this message and put
"unsubscribe" in the subject box.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dan R. Johnson
Sent: Monday, March 31, 2003 5:05 PM
To: [log in to unmask]
Subject: Re: [TN] BGA's on both sides of an assemblyKeep it up Steve,It's almost like being there, lucky you. ;)Dan---------------------------------------------------
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