Hi Rich!

Glad to see that I'm not the only one having problems with these guys. Well, not really glad, but now I know I don't have to feel alone...

I had the same problems, not full, straight-up tombstones, but "draw-bridges" (Now let's not get into a discussion about the difference again Werner...hehehe).

But we finally resolved the issue, it really was pad geometry related. The pads were 1.27mm apart on the board, and panasonic recommends a 1.00mm gap.

The IPC-782 recommends a .6mm gap for 0805 components. The board was spun and the gap was changed to panasonics recommendation, and I also used a 2% silver solder paste. The problems that I had, have disappeared.

-Steve Gregory-

Good afternoon everyone,

I am currently reviewing a tombstoning problem that we are having with the capacitors listed below.  We are seeing this problem on two separate electronic assemblies but only with this component style.  We place 40 caps per array and approx. 3 - 5 of them tombstone.  Both assemblies go through the SMT process and they both are using a Panasonic ECH-U1H152JB5 and ECH-U1C153JB5 film capacitors.  The placement of the capacitors pre-reflow is centered correctly between the pads.  But of course post reflow - tombstone!

 

Any thoughts, ideas, or experiences with this part would be helpful.

 

Thanks in advance for your help.

 

Rich Lasko

Badger Electronics 





-Steve Gregory- ---------------------------------------------------
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