Hello
all,
I need to find
requirements which specify lead tinning requirements.
We have a supplier
which is performing a lead tinning process called "DIP-N-SPIN". Is anyone using
this process? The device is dipped and then spun at 2000RPM. This process leaves a
very thin layer of tin/lead on the leads. Measured data shows
20micro-inches, this is over Kovar leads. Seems I remember 300 micro-inches from
some document. We're having problems with solderability and fractured
solder joints. IPC or MIL standards would be great.
Thanks in
advance,
Randy