Hi John,

Normally you don't need any glue at all. The total surface area of the
solder joints is very large compared to the weight of the part, therefore a
BGA will not fall off during inverted reflow. Just be carefull with
heatsinked parts, as they can be quite heavy.

Daan Terstegge
http://www.smtinfo.net


----- Original Message -----
From: "John Belcher" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 31, 2003 9:28 PM
Subject: Re: [TN] BGA's on both sides of an assembly


> Thanks Ramon. That's exactly what I needed.
> John Belcher
> ----- Original Message -----
> From: "Dehoyos, Ramon" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Monday, March 31, 2003 11:12 AM
> Subject: Re: [TN] BGA's on both sides of an assembly
>
>
>         John:
>         After reflowing one side, glue the BGAs with water soluble glue,
> then do the other side. After the wash, the glue will be gone. The four
> corners are the better areas for placing glue. Make sure that glue does
not
> come in contact with solder joints to avoid glue solder combination.
>         Regards,
>         Ramon
>
>
>
> > -----Original Message-----
> > From: john Belcher [mailto:[log in to unmask]]
> > Sent: Montag, 31. März 2003 17:57
> > To: [log in to unmask]
> > Subject: [TN] BGA's on both sides of an assembly
> >
> >
> > Any secrets to mounting BGA's on both sides of an assembly?
> >
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