Hi Paul,

If you have the option than choose the package which your process can handle
best.
Handling a component in a process doesn't stop at SMA. Think of Inspection &
Repair.
You should be able to inspect and repair a board with a 0.5mm pitch BGA
before allowing it on any design.

Implementing BGA's in your process is a bit scary in the beginning, but the
components are less susceptible to "handling-damage".
Once the process is setup right you'll see less defects than with fine pitch
QFP's.

Hope this helps a little in making up your mind.



Jowan Iven

Process Engineer



  -----Original Message-----
  From: TechNet [mailto:[log in to unmask]]On Behalf Of Black, Paul
  Sent: vrijdag 7 maart 2003 0:23
  To: [log in to unmask]
  Subject: [TN] BGA vs. QFP


  Hi Technetters,

  Up until now, I have been spoiled in that the only BGA that I have had to
deal with had a 1.25mm pitch. Now, for a new design, Engineering is giving
me an option of a 64 pin BGA or QFP. Both have a pitch of 0.5mm; is the
consensus to stick with the BGA? Are there any potential gotcha's?
  Thank you,
  Paul Black
  Manufacturing Engineer
  Kronos


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