Hi, Paul, If I were give the choice, I know which option I would go for - the QFP. Board space required to locate the QFP and its associated fan-out is greater, but if the design can afford the real estate, go for it. Points in favour are: - No need to X-ray in order to inspect joints - More 'flexible' than BGA's (better strain relief), therefore more resistant to creep fatigue. - No need to underfill (if you do). - PCB Flatness criteria not quite so vital. - Rework is quicker and cheaper (especially if BGA is underfilled) - Fewer long-term reliability issues (no cracked balls, if you'll pardon the expression) - Thermal profiling is easier. - etc. Points against: - QFP's take up more board space than BGA's. - They don't self-align as well as BGA's do during reflow. Peter "Black, Paul" <[log in to unmask]> 07/03/2003 07:22 AM Sent by: TechNet <[log in to unmask]> Please respond to "TechNet E-Mail Forum."; Please respond to "Black, Paul" To: [log in to unmask] cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group) Subject: [TN] BGA vs. QFP Hi Technetters, Up until now, I have been spoiled in that the only BGA that I have had to deal with had a 1.25mm pitch. Now, for a new design, Engineering is giving me an option of a 64 pin BGA or QFP. Both have a pitch of 0.5mm; is the consensus to stick with the BGA? Are there any potential gotcha's? Thank you, Paul Black Manufacturing Engineer Kronos --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- [This e-mail is confidential and may also be privileged. If you are not the intended recipient, please delete it and notify us immediately; you should not copy or use it for any purpose, nor disclose its contents to any other person. Thank you.] --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------