BGAs is a generic term.
Plastic BGAs (PBGAs) normally have 63/37 solder balls and they due partially collapse during reflow.
Ceramic BGAs (CBGAs) have the 90/10 alloy balls to avoid the "collapse to the board" phenomena.
[log in to unmask]
-----Original Message-----
From: Blair K. Hogg [mailto:[log in to unmask]]
Sent: Thursday, March 06, 2003 4:00 PM
To: [log in to unmask]
Subject: Re: [TN] Solder ball composition

I haven't worked with BGA devices much, but I would suspect that you wouldn't want the balls to reflow during normal operations. Wouldn't the solder just spread out everywhere and the part collapse onto the board?

>>> [log in to unmask] 03/06/03 03:40PM >>>

Fellow TechNetters,

    What is the reasoning behind using High Temp Solder ( 95/5 ) for BGA's versus conventional
63/37 Eutectic solder besides different melting points?   Is the strength factor an issue.

I would like to hear from the metallurgical group on this issue.

Victor,

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