Solder ball composition
 
Victor,
 
You usually only find high-temp solderballs on ceramic devices.  The reason for the high-temp solderballs is to increase the column height to improve solder joint reliability.  This is due to the CTE mis-match between the Ceramic and FR-4.

Russell Nowland
Lucent Technologies, Suite 100
7725 West Reno Ave.
Oklahoma City, OK 73127
Phone: 405-782-7765
Fax: 405-782-7905
email: [log in to unmask]

-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: Thursday, March 06, 2003 2:40 PM
To: [log in to unmask]
Subject: [TN] Solder ball composition

Fellow TechNetters,

    What is the reasoning behind using High Temp Solder ( 95/5 ) for BGA's versus conventional
63/37 Eutectic solder besides different melting points?   Is the strength factor an issue.

I would like to hear from the metallurgical group on this issue.

Victor,

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