First of all, the overall board thickness: consult your PCB manufacturer on
his aspect ration limit: it can be anywhere between 1:7 to 1:14. The minimal
hole diameter should not be less than the PCB depth divided by the aspect
ration.

After this, consider the current capacity of every via: 0.01 mils via can
carry 0.4 A; 0.012" via can carry 0.5A.

Third, consider signal integrity and skin effect. The difference should not
be big in most cases, but RF boards and very high frequency digital boards
may be affected.



Regards

Ofer Cohen

Quality Assurance Manager

Seabridge Ltd.

-----Original Message-----
From: Genny Gibbard [mailto:[log in to unmask]]
Sent: Wednesday, March 05, 2003 18:42
To: [log in to unmask]
Subject: [TN] info requested


We have an 8 layer board that we need to turn into a 10 layer board.  We
have adjusted our layer stackup to accommodate the extra layers without any
significant change in overall thickness, but we are still having trouble
fitting everything we need onto the layout.
What are the implications of going from a minimum .012" via to a 0.010" via?
What do we need to take into consideration?  What things might be critical
to spec to the board fab house?

Genny Gibbard ( mailto:[log in to unmask]
<mailto:[log in to unmask]> )


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