Paul,
My recommendation would be a
solder fountain type system. We happen to use SoldaPac machines made by
Electrovert, but I'm sure others would be fine. The procedure is a bit tricky.
You can see our online procedure at: http://www.circuittechctr.com/guides/8-1-2.htm.
We could also help you with the project if you need it.
Hi
TechNetters,
I have run into a
situation where I may need to remove and replace a 68 pin through-hole socket
that is used to house an SMT PLCC device. The board is .062" @ 4 layers,
and the socket is somewhat isolated in a corner of the board. Potentially, this
might be done on a few thousand units. My first thought is selective soldering.
From your experiences, whom should I consider? Do you have any other
thoughts?
Thank you,
Paul Black
Manufacturing Engineer
Kronos
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