Fellow Technets, As the industry moves towards lead-free solder, I am getting a lot of internal questions regarding the phenomena of tin whiskers and the types of plating/tinning used on component leads. There is a general concern that 100% tin plated leads may lead to the formation of tin whiskers after board assembly. I am not that familiar with the phenomena of whisker formation or the industry standard(s) for plating of component leads but have read articles that imply that industry is moving towards 100% tin plating on component leads so they are compatible with leaded and non-leaded solders. Who can enlighten me on this as well as the formation of tin whiskers? many thanks in advance. joe --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------