Rich, To emphasize Jorge's first point: As small the component is, as sensitive it is to layout problems, regardless of specific problems of manufacturer, product line or production batch. Take a good look into the PCB design: Are the connections to the component's pads symmetrical? Isn't one pad connected to massive conductor or layer, while the other one is not? Aren't the conductors connected to the pads in opposite directions, causing the component to rotate during the reflow? We've experienced such layout problems, and PCB revision solved them. Regards Ofer Cohen Quality Assurance Manager Seabridge Ltd. -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Wednesday, March 19, 2003 23:12 To: [log in to unmask] Subject: Re: [TN] Panasonic Film Chip Capacitors and SMT Reflow Rich, Once in a while there is always somebody having problems with these components. Personally I've ran into problems with Panasonic plastic film caps a couple of times, the first time almost three years ago. The problems you are experimenting are very typical, I'd check four things: 1. Make sure the foot print matches what's recommended by Panasonic. These components are very light weight and tend to tombstone if foot print is not appropriate. 2. If I remember two to three years ago Panasonic released an "X" version of the component. This is suppose to be improved for SMT operation/Reflow process. You should look into it, maybe that by itself resolves your problem. 3. The version "B" of the plastic film caps. seem to have some sort of contamination on the leads that causes tombstoning. This contamination is either the dielectric bleeding out or a resin. The bottom line is whatever Panasonic did, the "X" version seems to solder better. 4. And the last recommendation. I'd implement a soak oven profile, that way you let the board reach a thermal equilibrium before liquiduos and thus eliminate/diminish the tombstoning or solder opens. We actually use this type of profile when we have tombstoning concerns. Hope this information is useful, Jorge Rodriguez Process Engineer Varian Electronics Manufacturing E-mail: [log in to unmask] -----Original Message----- From: Rich Lasko [mailto:[log in to unmask]] Sent: Wednesday, March 19, 2003 1:51 PM To: [log in to unmask] Subject: [TN] Panasonic Film Chip Capacitors and SMT Reflow Good afternoon everyone, I am currently reviewing a tombstoning problem that we are having with the capacitors listed below. We are seeing this problem on two separate electronic assemblies but only with this component style. We place 40 caps per array and approx. 3 - 5 of them tombstone. Both assemblies go through the SMT process and they both are using a Panasonic ECH-U1H152JB5 and ECH-U1C153JB5 film capacitors. The placement of the capacitors pre-reflow is centered correctly between the pads. But of course post reflow - tombstone! Any thoughts, ideas, or experiences with this part would be helpful. Thanks in advance for your help. Rich Lasko Badger Electronics --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------