John, Wow, That seems an excessive amount of work for a heat sink finish. What is driving you to go to this level of finish? We have upped or tightened our heat sink surface specs at quite a significant cost and I can't say that it has made a significant improvements in performance for the cost. I believe that the biggest offender for us has been contaminates (dirt, metal chips) under the Isostrate thermal transfer material that has caused a punch through during a Hi-pot test. Phil Nutting -----Original Message----- From: Grabski III, John R. [mailto:[log in to unmask]] Sent: Monday, February 24, 2003 10:15 AM To: [log in to unmask] Subject: [TN] off topic, more plating (kinda)... We have a roll of silver solder in house, and I want to try a little project with a couple heatsinks... One's copper, the other is aluminum... They've been lapped, and have near-mirror finish... I'd like to take 1/32" off both and drop on an even coat of this silver solder... I don't know how well they will bond, and wonder if some chemicals will need to be used to aid in the bonding process... Or do I just let it drip onto the surface?? After the silver's on there, I'm gonna lap THAT finish to mirror-ish quality and run some temperature tests... Any advice?? Best Regards, John Grabski III Badger Technologies, Inc. --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------