First let me say that this was the opinion of one manufacturer.
        The idea is that the connection between the dogbone was to
        be consistent so that the thermal path from the ball to the
        via dissipates the same amount of heat, on all connections, even
        grd and pwr ball pads. Its documented in Intel's recommended
        fan outs.
        Lou Dallara CID
       

Louis wrote:
>My former company did 8 mil, all bga fanout had to have same width. this was for solderability
 
Could you explain how a wider line can improve solderability?
 
Thanks
Stefano
 
 
 
----- Original Message -----
From: [log in to unmask] href="mailto:[log in to unmask]">Louis Dallara
To: [log in to unmask] href="mailto:[log in to unmask]">[log in to unmask]
Sent: Thursday, February 20, 2003 9:27 PM
Subject: Re: [DC] BGA routing

         My present company doesn't limit the max on bga fanout.
         My former company did 8 mil, all bga fanout had to have same width. this was for solderability
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, February 20, 2003 3:06 PM
To: [log in to unmask]
Subject: [DC] BGA routing

 
I'd like to start an informal poll:
 
How many companies use an 8 mil maximum for line width going into a BGA ball?

--
George Patrick
Tektronix, Inc.
Central Engineering, PCB Design Group

P.O. Box 500, M/S 39-512

Beaverton, OR 97077-0001

Phone: 503-627-5272         Fax: 503-627-5587

http://www.tektronix.com
    http://www.pcb-designer.com

It's my opinion, not Tektronix'


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