Where do I start?  Does anyone know of any good sources for obtaining information on the pro's and con's of different vent patterns and of how to apply them?  Does such info exist other than in the minds of process engineers?
 
We generally apply a staggered dot vent pattern to all open areas of the panel.  We are currently manufacturing a 0.040 8 layer board using 0.005 core, utilizing the following layup
 
 TOP - Component Side     ----------                             
                                       ///////   .005 Core H/H              
  LAY_2 - Signal              ----------
                                       \\\\\\\\   2x106 prepreg
  LAY_3 - Signal              ----------                         
                                       ///////   .005 Core H/1 
  LAY_4 - Plane               ----------
                                       \\\\\\\\   2x106 prepreg          
  LAY_5 - Plane               ----------                  
                                       ///////   .005 Core 1/H 
  LAY_6 - Signal              ----------
                                       \\\\\\\\   2x106 prepreg         
  LAY_7 - Signal              ----------                   
                                       ///////   .005 Core H/H           
  BOT - Solder Side        ----------      
 
Cap construction (as opposed to foil lamination) used for this build because of blind vias between layer 7 and 8.
 
We were seeing some irregular movement after pressing to which we attributed to resin flow.  On some technical advice from our laminate supplier we removed a good majority of the vent pattern retaining only what amounted to approx .75" wide border around the panel with similar .75 band splitting the panel horizontally and a .5" band splitting the panel vertically.  The panel is 18x24 so the vent pattern basically splits the panel into quadrants, each quadrant containing a 1.7x2.6 memory board.  I know this is difficult to do without graphics (darn listservers!).
 
What we saw after pressing these panels was an improvement in the movement in that we now had a more symmetrical movement about the center of the panels but a significant increase in panel warpage (no real warpage issues when using our conventional vent pattern placement).  We pressed one book with 5 panels and saw some panels warp about the x-axis, some about the y-axis, one was reasonably flat.
 
I would appreciate any insight into the general usage of vent patterns and the pros and cons of the t=different pattern styles, ie dots vs starburst.  I would also be interested in opening a dialogue with any knowledgeable individuals specifically relating to our problems with this particular board.
 
Regards
John Parsons
 
 
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