Peter, no, they are normally not coated, but I think it is a solution to save them. (we have a coating process installed in our facilities) Marie > -----Original Message----- > From: [log in to unmask] [mailto:[log in to unmask]] > Sent: mardi, 14. janvier 2003 10:34 > To: [log in to unmask] > Cc: [log in to unmask] > Subject: Re: [TN] voids in gold plated holes > > > > Marie, > > Are your boards to be conformally coated? If you're worried > about exposed > copper, you could try filling the holes with dilute conformal > coating - > though you will probably have to put the boards in a vacuum > oven to pull > the air out of the holes and allow the coating to penetrate > and coat the > walls of the holes. > > Peter > > > > ME Magnin <[log in to unmask]> 14/01/2003 04:02 PM > Sent by: TechNet <[log in to unmask]> > > Please respond to me.magnin > > > To: [log in to unmask] > > cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST > Aero/ST Group) > Subject: Re: [TN] voids in gold plated holes > > > > > > > > > > > > > Thanks for this answer and all the others > I was not sure, when reading IPC A600 3.3.9, that it was talking about > copper voids or all plating voids. I understand now that the > last is the > correct understanding. > I can see exposed red copper in these voids, I suppose there > has been a > problem during nickel plating, thus consequently gold is missing too. > The number of voids is close to the acceptance limits, > depending on the > standard I base on (IPC or PERFAG). > But my major concern is that the boards are finished now, and > I am not sure > I can deliver them like this : bare copper is still exposed > because I have > had poor vertical fill (we use a no-clean solder flux). > > > > ME Magnin > > FIRSTEC SA > Rue du Grand Pr¨¦ 70 > CH 1211 Gen¨¨ve 2 > > > T¨¦l. : +41(0)22 918 36 85 > Fax : +41(0)22 918 36 93 > mailto:[log in to unmask] > http://www.firstec.ch > > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask] > Sent: lundi, 13. janvier 2003 20:58 > To: [log in to unmask] > Subject: Re: [TN] voids in gold plated holes > > Marie > If you look in IPC-6012A, para 3.3.3 There is a table 3.3 > that has the > requirements for Finish Coating. Then depending upon which > class your > product has been built to meet, you can see the > requirements. Class 2 > says "Three voids allowed per hole in not more than 5% of > the holes" for > example. > > Bare copper is always a reliability concern - especially if it is in > contact with gold. Remember that the nickel is put on to > prevent the gold > and copper from reacting. > > Susan Mansilla > Robisan Lab --------------------------------------------------- > Technet Mail List provided as a free service by IPC using > LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with > following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm > for additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 > ext.5315 > ----------------------------------------------------- > --------------------------------------------------- > Technet Mail List provided as a free service by IPC using > LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with > following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm > for additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 > ext.5315 > ----------------------------------------------------- > > > > [This e-mail is confidential and may also be privileged. If > you are not the > intended recipient, please delete it and notify us > immediately; you should > not copy or use it for any purpose, nor disclose its contents > to any other > person. Thank you.] > --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------