Yes, revision B of the J-STD had a nice set of Appendix thoughts. They are not in the C revision. Those guidelines may appear in the IPC 7070 series of documents. I thought some of them were ready to print. I must admit I have not kept up with my obligations to the committee. Sorry everyone. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Kathy Kuhlow > Sent: Thursday, January 09, 2003 9:30 AM > To: [log in to unmask] > Subject: Re: [TN] Help anyone!!! > > > Well, I agree the dimension J is not in violation it is over > the lands. But in the J-STD 001 appendix B there is a > section for Placement Requirements for SM parts I remember it > had some additional requirements by device type for height > off of the pads. > > I would question if these are ceramic chip caps and only one > end of the device was soldered you may very well have caused > cap cracks from thermal imbalance across the part. I would > replace all parts if only one side was soldered otherwise you > may have a problem with leaky caps in test. > > Kat --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------