Ofer, I would suggest that you send your designer on a DFM course, and ask your suppliers for design rules. From what I see of the comments on your design, the product was designed on a wish and not a practical basis. If you pay enough money, you can buy anything, but this product is at spacecraft prices. Dougal Stewart email: [log in to unmask] phone: +44 1896 822204 mob: +44 7984 629667 www.pwbsolutions.co.uk ----- Original Message ----- From: "Ofer Cohen" <[log in to unmask]> To: <[log in to unmask]> Sent: Thursday, January 30, 2003 6:20 AM Subject: Re: [TN] PCB00229 manufacturing issues. > Good day to all, > We have designed a controversial board. A manufacturer that we called claims > that the design has a problem of long-term reliability problem. I attach the > analyzer pictures and the commentary. > > The intended material is Arlon 55ST. The PCB will have 22 layers. > > As being specialized in the reliability and quality aspects rather than in > the technological aspects, I would like to get some opinion as of the > influence of the design on the reliability. If possible - some guidelines on > qualitative connection between the design rules and the board reliability. > > Regards > Ofer Cohen > Quality Assurance Manager > Seabridge Ltd. > 3 Hanagar St., Neve-Ne'eman > POB 7242 > Hod Hasharon 45241 > Tel Direct: +972-9-775-1104 > Tel Operator: +972-9-775-1111 > Mobile +972-55-623336 > Fax: +972-9-775-1100 > mailto:[log in to unmask] > Website <http://www.seabridge.co.il/> > Announcement of Confidentiality > This e-mail message, as well as any attached document, is confidential and > may be privileged. It may be read, copied and used only by the addressee. If > you have received it in error please destroy the message and any attachment > and contact us immediately. > > > Manufacturing design issues. > > 8. , 9. , 10. , 13. , 14. , 15. , 16. > Removed - non critical issues > > 1 > Sub-composite vias have no O/L annular ring - design has 11 mil drill with > 10 mil pad. Hole to plane spacing is only 4 mils. Manufacturing requires > that vias must have pad sizes that are 12 mils larger than the drill size. > The spacing between via pad and surrounding copper plane should be 8 mils > minimum design. > <<subviapads.gif>> > > 2 > Blind via hole misregistration to capture pads down to 1.7 mil a/r. > Manufacturing requires holes to be centered in innerlayer capture pads as > well as outerlayer pads. > <<viacapturepads.gif>> > > 3 > Non-plated hole to copper spacing of 4.8 mils. Need to increase spacing to > 10 mils. > <<npttocopper.gif>> > > 4 > Plated thru hole spacing to trace of 4.4 mils on innerlayers. Manufacturing > requires spacing of 10 mils between drill hole and traces. > <<seag hole to trace.gif>> > > 5 > Plated thru component hole misregistration down to 1.7 mil a/r > Manufacturing requires holes to be centered in the pads to prevent hole > breakout. > <<seag hole reg.gif>> > > 6 > Thru vias have 20 mil pads with 12.5 drill. Need to allow partial hole > breakout and allow tear dropping of pads for annular ring at pad/trace > junction. > > 7 > Outerlayer pads smaller than drill size for 70 mil PTH size at several > locations. Manufacturing needs pads 6 mils per side larger than drill for > annular ring. > <<no AR for 70pth.gif>> > > 11. > Spacing between hole and plane is down to 6.7 mils due to hole > misregistration. Need 10 mil spacing between hole and plane. > <<holetoplane.gif>> > > 12. > Pad to pad spacing of 2 mils on layer 21. Need to clip pad to 6 mil > spacing. > <<2mil spaceL21.gif>> > > 17. > Spacing between blind via hole to buried via hole is less than 3 mils down > to .7 mils partly due to hole misregistration in design. Design spacing > should be 3 mils minimum between blind via hole and buried via hole edges. > <<.7milspaceblindtoburied.gif>> > > --------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------