Steve:
I' ve worked with the Dynachem and the Dupont dry film. To me it looks the problem is pre clean prior to dry film application. The film seems to be peeling from all Cu. surfaces, vias and traces. I don't think the plating is to high on the surface.
( Its kind of hard to plate 4 mils of copper unless the operator fell asleep)
Try tape testing the assem. before processing for mask peel.
Hope it helps
Frank