RE: [TN] CP CPK Calculations
Paul,
 
Yes.  We've seen them on QFPs and TSOPs as well as BGAs.  It's really a matter of moisture sensitivity rating, not package type.  The damage is not always externally visible.  Sometimes it requires CSAM analysis to detect (internal delamination).
 

Howard A. Cyker
Lucent Technologies
Engineering Infrastructure - New Product Engineering

-----Original Message-----
From: Stolar, Paul W [mailto:[log in to unmask]]
Sent: Wednesday, January 22, 2003 11:50 AM
To: [log in to unmask]
Subject: [TN] Moisture sensitive

Has anyone ever seen moisture damage in plastic IC's which are not BGA's?

 

Paul Stolar

Materials Engineer

Baker Atlas

713-625-5376

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