Date: Thu, 16 Jan 2003 14:11:59 -0600
Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>,
Bill Christoffel <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
From: Bill Christoffel <[log in to unmask]>
Subject: Re: BGA Dye Penetrant
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In my past life we used zyglo prodcut that worked well to detect cracks in and around chip on substrate (hybrid) circuits. I did a google search and found this contact: www.vobaker.com/ndt/zguide.htm
Bill C.
-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: Thursday, January 16, 2003 2:06 PM
To: [log in to unmask]
Subject: [TN] BGA Dye Penetrant
Fellow TechNetters:
Any beamers out there from Fishkill or Burlington
Back in the days with Big Blue a fluorescence yellow solution was used
to detect BGA interface voiding. The
solution was detectable under black light. The sample and solution were
pressurized to accomplish the task. I
have TRIED to use the Steel Red DYKEM for a similar project with no success.
Can one shared their experience
with void detecting techniques and/or materials.
In advance I will thank you for your timely response in this matter.
Victor G. Hernandez
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