Dear Technetters hello We are facing some problem of BGA soldering, actually we are using the oval shape pad on PCB for BGA This is for better analysis to find the open joints in X ray inspection M/c. The problem is in between the Tin plated and the gold plated pad for same type PCB . if we reflow both type of PCB at same Profile then we find the tin plated PCB has much more oval shaped joint then gold plated. Can any body tell me the basic deference about the wetting or molten solder flow on gold plated and the tin plated Pads. With regards Pankaj Karnwal QualityAssurance Ext.211 BESL A-4,Sec-5 NOIDA,201301,INDIA e mail : <mailto:[log in to unmask]> Barco,innovators in image processing --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------