From
IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards; Sub-section
9.1.5 Conductive pattern Feature Location:
Greatest Board Dimension between 300 and 450 mm
Complexity Level A -> 0.35 mm Level B ->
0.25 mm Level C -> 0.15 mm
This
applies to lands, connector contacts and conductors in relation to datums. This
tolerance includes tolerances for master patterns accuracy, material movement,
layer registration and fixturing.
Techers,
Any one out there have information on what the
dimensional tolerance is for surface mount
pads(BGA's, QFP's) across
a board size of 13 X 11 inches. Customers
print does not specify and can not find in IPC the default spec.
Thanks,
Tony Steinke
AIT-Atlanta
Inc.
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