Message
From
IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards; Sub-section
9.1.5 Conductive pattern Feature Location:
Greatest Board Dimension between 300 and 450 mm
Complexity Level A -> 0.35 mm Level B ->
0.25 mm Level C -> 0.15 mm
This
applies to lands, connector contacts and conductors in relation to datums. This
tolerance includes tolerances for master patterns accuracy, material movement,
layer registration and fixturing.
Techers,
Any one out there have information on what the
dimensional tolerance is for surface mount
pads(BGA's, QFP's) across
a board size of 13 X 11 inches. Customers
print does not specify and can not find in IPC the default spec.
Thanks,
Tony Steinke
AIT-Atlanta
Inc.
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Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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