I've replied elsewhere regarding the ozone-depletion potential of HCFC-141b. HCFC-141b is in the process of being phased out as a solvent, but this is a national, rather than an international process. HOWEVER, although its blends have a higher Kauri-butanol number than CFC-113, it has often proved to be a poor solvent for many rosin-based flux residues, especially RMA types. "White residues" are a frequent result and reliability has been shown to be diminished with some flux/solvent combinations. It also tends to be aggressive (stress cracking) towards some polymers, so be careful if you use polystyrene or polycarbonate capacitors (or other insulation) or even PVC. Be sure to do your qualification testing very well! Brian Juan T. Marugán wrote: > Hi technetters ! > > Although I’ve read some messages about this matter, let me ask you some > additional information. > > For our class 3 boards (avionics & military), we used rosin fluxes (ROL0). > Now, we are thinking about to subcontract the assembly of some type of > boards. One of the possible subcontractors uses no-clean organic flux > (ORL0) for wave soldering. No post-solder cleaning is performed. > > After this assembly, we have to solder some components/wires to these > boards so we will use our rosin flux. And, at the end, boards will > conformal coated with Humiseal (acrylic). > > My questions are: > > 1.- Can the use of an organic flux (residues) to produce some effect in the > solder joints performed later using rosin flux? > 2.- What happen when these boards are cleaned with CFC solvents (Forane)? > 3.- Have no-clean flux residues some effect in the quality (adherence, ...) > of conformal coating? > > Thank you from Spain for your help. > > > Juan T. Marugán López > Production Quality Assurance > > INDRA EWS, Sociedad Anónima > C/ Joaquín Rodrigo 11 > 28300 Aranjuez - Madrid (SPAIN) > [log in to unmask] > www.indra.es > > --------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > ----------------------------------------------------- > > > > > --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------