Greetings to all, With the recent dialog about the cross-contamination and lead-free reliability concerns, copper solubility concerns, the introduction of application specific reliability (which has been slowly becoming an accepted approach), the 1/2 dozen or so different finishes and dozen or so different lead-free solders, the number of potential combinations and variations to keep track of becomes mind numbing. It does not seem possible, from my simple point of view, to go from specific to general or to make sweeping statements about the reliability of lead-free based on the relatively few combinations that have been tested. As has been noted many times we have fifty years of experience with traditional solders. It seems a waste to toss that experience out the window based on all that we have yet to know about lead-free. The IPC board of directors has a position statement on this subject. Aside from an inconsistency in the amount of lead used annually in electronic assembly (the IPC BOD statement says less than 2% while the generally accepted number based on multiple industry analytical reports is ~0.5%, however I trust that their webmaster will get around to correcting it at some point), it is an important document to read relative to the recent discussions. For example, the IPC Board of Directors have noted in their lead-free position statement: "These new technologies should provide product integrity, performance and reliability equivalent to lead-containing products without introducing new environmental risks or health hazards" This statement is clear and unequivocal in its intent... Equal reliability with no greater environmental impact. Unfortunately this objective will likely never be met in total as the total energy requirements for most lead-free candidates are much higher than traditional solders. Moreover, with the myriad of potential lead-free permutations based on finish and solder, the real reliability of each combination may only come slowly to light passed on only by anecdotal information from field failures and product returns. The IPC position also states: "... all available scientific evidence and US government reports indicate that the lead used in US printed wiring board (PWB) manufacturing and electronic assembly produces no significant environmental or health hazards." Still no data has been presented to provided evidence to the contrary which continues to beg for an answer to the question. "Why must traditional solders be eliminated?" The IPC BOD statement finishes with: "IPC prefers global rather than regional solutions to this issue, and is encouraging a coordinated approach to the voluntary reduction or elimination of lead by the electronic interconnection industry." Again clear intent that this effort is to be voluntary and more importantly that reduction is considered equivalent to elimination. This is a wise approach in that it allows for the individual to make the choice. At this point I would note that the electronics industry has continued to reduce the amount of lead in its many products over the years simply by making its products smaller but we have not given ourselves credit for that. While the scientific and engineering prowess of those who are struggling to make lead-free work is truly admirable, it is looking like it may take another generation or so to fully sort through all of the options. Still, I do take heart in believing that there will be new solders available now to solve problems for specific applications. I have had a number of ideas wherein lead-free solders will play a potential role. There are also, however other matters that need to be considered. On the economic side there is also the matter of intellectual property which will demand a rightful premium in exchange for the research performed this is a rent or royalty that must be paid over the 17-20 year life of the patent unless all the more that 400 US and international patents with reference to lead-free solder (so far) will be pooled and given freely to industry and I don't see this as likely. In contrast, Pb37Sn63, has no patents. Finally, if there is to be recycling, as has been suggested as the next step, the whole matter of lead in solder is moot and moreover it is logically much easier to recycle a simple binary alloy than a multi-element alloy. It seems, to me at least, that we need to make certain that we think beyond the horizon if we are going to get this thing right. Passage of a law does not make the law or its intention right. Kowtowing to a bad law does not make the law right either. Some backbone and action may be required to make it right, however. Governments who ignore the council of their own scientists in passing emotionally based legislation should be challenged and held accountable for their decisions. Traditional solder, it seems, got swept in with some very risky and hazardous elements. It makes the line "Round up the usual suspects" spoken by Captain Louis Renaud, the Vichy French police chief at the end of the film "Casablanca" come to mind. However here it is like a graffiti artist suddenly becomes an equal in criminality with a rapist or murderer and is meted out a similar measure of punishment. (Recall again that that there is no evidence to support the indictment of traditional solders used in electronic products of harm to humans) Is this right or just? As has been suggested several times here, write to your elected representatives and make them aware. Invest in a sheet of paper, an envelope and a stamp when doing so. The weight of the physical letter is small in grams but immense in political terms. Follow up with the e-mail if you wish but send the letter. With hope for a more rational future and with kind regards to all, Joe --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------