Good points Ken. (Got my number, have you? ;-) As you point out, the logistics of such seemingly mundane matters only adds to the growing list of nagging problems attendant with solving what is in truth a non-problem. I suspect that, if we follow the present course, the assembler will at some point have to identify, on each assembly, which exact type(s) of solder were used for which devices. Nothing like an increase in complexity to reduce cost and increase reliability ;-) Maybe at some point the politicians will declare a moral victory and allow the electronnics assembly industry to get on with doing the right thing for its products and its customers and continue to use traditional solders with the blessings of good science. Kind regards, Joe --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------