A couple quick questions regarding temperature profiling of BGA's at a re-work station. I posted maybe a month back and from the (2) responses I gather that drilling holes to feed the thermocouples from under the board is the standard practice. I tried this, however the best I could do was *attempt* to ensure that there was contact between the tip of the thermocouple and a BGA solder ball. (the thermocouples came up from under the board, and I tried to place the BGA such the tips of the thermocouples would be in contact with the side of a BGA ball. I have 3 thermocouples (middle, side, corner) under the BGA, and the BGA is held down by chip bonder at 2 opposite corners) When I tried getting temperature values at the re-work station, I was getting inconsistent numbers. The other method I've tried was to use thermally conductive adhesive to hold a thermocouple between the chip and the board (with no drilling -> ie. the thermocouple wire lies flat against the board and held down by the adhesive and the chip). This method seems to result in more consistent temperature readings. Can anyone comment on whether the adhesive method is used and reliable, or if theres something I'm doing wrong with the drilled board method? Thanks, Toby Chang Process Engineerin Co-op Leitch Technology International Inc. --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------