Ioan, I think you can find instances of both, but it is the ones that make it through ICT that are really painful. Since the fracture site is flat and at the pad level, it is very easy for the "black pads" to make electrical contact during ICT. This is especially true if you have a mechanical pull down type fixture. Thanks, Robert Furrow Printed Wiring Board Engineer Supply Chain Networks Lucent Technologies 978-960-3224 [log in to unmask] -----Original Message----- From: Tempea, Ioan [mailto:[log in to unmask]] Sent: Friday, November 22, 2002 12:39 PM To: [log in to unmask] Subject: Re: [TN] Black pads suspected on ENIG pcbs: how to screen assembl ed pcbas ? Hi Mario and gentlemen, my question is if black pad is a time bomb, providing unreliable connections that will pass the functional test only to fail in the field. Or rather, the problem will appear right away after reflow and every single assembly that has black pad would fail test. Thanks, Ioan > -----Original Message----- > From: Mario Dion [SMTP:[log in to unmask]] > Sent: Friday, November 22, 2002 10:46 AM > To: [log in to unmask] > Subject: [TN] Black pads suspected on ENIG pcbs: how to screen > assembled pcbas ? > > Bonjour to the TECHNET people, > > What kind of screen testing must be perform on assembled units where black > pads problem is suspected ? > > The goal is to assess the reliability of the units. > > Thanks in advance for your help, > > Enjoy the week end ! > > Mario > > --------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------