You can guess what the normal problem would be, glue in paste. You can do it, just be careful where the needle foot will hit. You may need to get a new needle with the foot in another position. You also might solve the problem by using the dispenser to place some paste in the shadows. (It takes too long to do a whole board.) -----Original Message----- From: Paul Truit [mailto:[log in to unmask]] Sent: Friday, November 15, 2002 9:37 AM To: [log in to unmask] Subject: [TN] Glue dispensing In our manufacturing life when doing double sided SMT assy's that included through hole We have been using the stencil printer to apply the adhesive for the SMT components. I have a project that requires this method but the board just isn't designed for a high yield process through the wave solder machine due to component shadowing. Has anyone used a solder paste approach then put the boards through an adhesive dispenser? Thus you already have good solder joints on the SMT parts ... glue to hold them down ... and when the wave solder machine solders the TH parts the SMT parts are still soldered. Any thoughts of this process for increasing the yield of these boards? Redesign is pretty much out of the question. Are the bench top machines i.e. the Camelot 1414 a good match for this type of application? Or is there a different economical (Got to use that word now days) solution. We're running 3000 piece lot sizes with approximately 40+ SMT components. -- Paul Truit, Mfg. Eng. RBB Systems, Inc. 4265C E. Lincolnway Wooster, OH 44691 Ph. (330) 567-2906 ext 514 Fax (330) 263-5324 Email: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------