Mel Parrish
Director, Training Materials
Resources
Soldering Technology International
102 Tribble Drive
Madison,
AL 35758
256 705 5530
256 705 5538
Fax
[log in to unmask]
www.solderingtech.com
--------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------------Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Brian Toleno
Sent: Monday, October 07, 2002 11:40 AM
To: [log in to unmask]
Subject: Re: [TN] Gold Embrittlement
I have done some work looking at gold embrittlement of solder joints and we found a weight percent on the order of 4-5% in eutectic Sn/Pb solder joints can cause embrittlement, in cross sections we saw joints that started with Au-Sn rich globules, turn into needles and collect at the solder joint interface over time leading to embrittlement. There was a paper from Paul Vianco showing a 4 weight percent of Au in Sn/Pb solder leading to embrittlement.
Brian J. Toleno, Ph.D.
Sr. Applications Chemist
Loctite Electronics
15051 East Don Julian Rd
Industry, CA 91746
Ph: 626-968-6511 x304
Cell: 626-390-9562
--------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------