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Dear Alex:
 
I read your post on TechNet and there is some info I may be to help you with in regards to chip stacking.  I worked for a couple of stacking companies: 1) Cubic Memory a die stacking company and 2) Dense-Pac now known as D-Pac which stacked primarily TSOP memory chips, I also represented another company that also had a chip stacking technology similar to what D-Pac is doing.  If you are looking for this type of info, then I may be able to help you.
 
Regards,
 
Mark Roslawski
Vice President Marketing
 
ThermalWorks
2910 South Oak Street
Santa Ana, CA. 92707
 
Tel:  +1 (714) 540-8454  x166
Fax: +1 (714) 540-1299
 
Email: [log in to unmask]
 
Web Site: www.thermalworks.com
                www.SDCcircuits.com
 
 
----- Original Message -----
From: [log in to unmask] href="mailto:[log in to unmask]">Alex Krstic
To: [log in to unmask] href="mailto:[log in to unmask]">[log in to unmask]
Sent: Tuesday, October 15, 2002 12:47 PM
Subject: [TN] Stacking of components (SMD) Revisited

Hi all.  Well  I have gone through the archives hoping to find the “definitive” answer to no avail.  Does anyone have quantitative reliability data on stacking of SMD components?  All past discussions end in the conclusion that you can do it but don’t do it if you don’t have to.

 

Alex Krstic

NovAtel Inc.

 

 

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