Hello, Maybe this question is not typical Technet-related, but I think I can find some solder-expertise on this forum. By quickly dipping a copperwire of 0.6 mm in a HighMeltingPoint-solderbath (MP=296 -302°C), we succeed to take up 5 to 15 mgr (±1 mm(superscript: 3)) solder at 5 mm from the end of the wire (our target is 10 mgr). Because this is a non-equilibrium process the spread is rather high. Nevertheless we try to improve the reproducability. Important factors which we can control are: temperature and withdrawal speed . Surface tension (influenced by the flux) and viscosity of the solder must be important too but difficult to measure and to influence. I can use any ideas / considerations / information how we can improve the reproducability. some other related questions: -how long works the addition of 100 ppm Phosphor in the solder ? -which could be the influence of eutectic solder (Pb(subscript: 97.5)Sn (subscript: 1)Ag(subscript: 1.5) MP=309°C) versus paste range solder (HMP Pb(subscript: 93.5)Sn(subscript: 5)Ag(subscript: 1.5) MP=296-302°C) on the solidifying and reproducability on the wire? -we use flux to dip the wire and a scraper to evacuate the dross (lot of dross!) on the solderbath-surface, we do not know a soldercover(oil) except the too agressive ammonium-zinc-chlorides; are there alternatives? Bath is operating at 340°C. -are there alternative droplet depositioin techniques: what about droplet deposition by jetting? Feasable? Thanks in advance, Jos --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------