In a message dated 10/29/02 10:10:21 AM Central Standard Time, [log in to unmask] writes:
Ryan,
For the answer to your first question you will need to know the process parameters and the operating temperature of the assembly. The rate is highly dependent on temperature. As for nickel, the rates are factors lower but with gold it is almost instant.
Larry Tawyea
713-829-1166
Hi Technetters,
I can't find my references for the dissolution rate of Tin into eutectic Tin
Lead solder. Anyone know? And while we're at it, what is it for Nickel and
Gold?
Thanks,
Ryan Grant
Supplier Quality Engineer
(208) 363-3683
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