It is a significant advantage in electronics. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis > Sent: Tuesday, October 29, 2002 12:13 PM > To: [log in to unmask] > Subject: Re: [TN] Nitrogen drying? > > > Why N2? You would get exactly the same effect with dry air. > However, be > warned: if the air or nitrogen becomes humid, you will reach > an equilibrium state between the parts and the air or gas, > not perfect dryness. You will need several successive > "rinses" of dry gas to achieve low levels and probably > storage in large volumes, compared with the volume of the > parts. The only advantage of N2 over air is if you wish to > avoid an oxygen reaction, such as oxidation of reactive > metals, and this has damn-all to do with moisture (well, almost :-) ). > > Brian > > Gregg Klawson wrote: > > Hello Technet, > > > > A question came up this morning as to whether nitrogen > could be used > > as a drying agent for PWBs, components, etc. I know > nitrogen is used > > as a fill gas for dry boxes, bags and to provide a dry > atmosphere for > > component testing. I don't have a feel for the physics of using > > nitrogen to dry something out. We have a situation where baking at > > high temperatures may not be practical but immersion in a nitrogen > > atmosphere is. Any ideas, references would be appreciated. > > > > Thanks, > > Gregg > > > > --------------------------------------------------- > > Technet Mail List provided as a free service by IPC using LISTSERV > > 1.8e To unsubscribe, send a message to [log in to unmask] > with following > > text in the BODY (NOT the subject field): SIGNOFF Technet To > > temporarily halt or (re-start) delivery of Technet send e-mail to > > [log in to unmask]: SET Technet NOMAIL or (MAIL) > > To receive ONE mailing per day of all the posts: send e-mail to > > [log in to unmask]: SET Technet Digest > > Search the archives of previous posts at: > > http://listserv.ipc.org/archives Please visit IPC web site > > http://www.ipc.org/html/forum.htm for additional information, or > > contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > > ----------------------------------------------------- > > > > > > > > --------------------------------------------------- > Technet Mail List provided as a free service by IPC using > LISTSERV 1.8e To unsubscribe, send a message to > [log in to unmask] with following text in the BODY (NOT the > subject field): SIGNOFF Technet To temporarily halt or > (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE > mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest Search the archives of > previous posts at: http://listserv.ipc.org/archives Please > visit IPC web site http://www.ipc.org/html/forum.htm for > additional information, or contact Keach Sasamori at > [log in to unmask] or 847-509-9700 ext.5315 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------