You just gotta' tip your hat to someone who has enough curiosity to "cross -section his old house plumbing to find evidence of dezincification of the solder joints." Bruce Tostevin Benchmark Electronics Hudson, NH > -----Original Message----- > From: Dave Hillman [SMTP:[log in to unmask]] > Sent: Friday, October 04, 2002 11:46 AM > To: [log in to unmask] > Subject: Re: [TN] soldering brass to copper > > Hi! As far as I know the plumbing industry just ignores the issue! I have > seen some documented cases of plumbing failures due to dezincification but > my guess is that the solder joint sizes, amount of solder, tolerances, > etc. > are such that failures are minimal. Also, quite a bit of plumbing is done > with copper and not brass piping. During a remodeling effort some time > back > I saved a segment of the removed plumbing for cross-sectioning - and I did > find some evidence of dezincification in the solder joint but it had not > progressed to a point of failure (and the pipes were pretty old, I don't > think it would have ever reached the failure point). > > Dave Hillman > Rockwell Collins > [log in to unmask] > > > > > rgrant <[log in to unmask]>@ipc.org> on 10/04/2002 09:39:50 AM > > Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please > respond > to rgrant <[log in to unmask]> > > Sent by: TechNet <[log in to unmask]> > > > To: [log in to unmask] > cc: > > Subject: Re: [TN] soldering brass to copper > > > So what is done in the plumbing industry? All the valves in my house that > I > soldered to my copper pipes are a brass based alloy (which soldered quite > nicely). > > -----Original Message----- > From: Dave Hillman [mailto:[log in to unmask]] > Sent: Friday, October 04, 2002 7:51 AM > To: [log in to unmask] > Subject: Re: [TN] soldering brass to copper > > > Hi TechNet! Sorry Guy but Mike Fenner already beat me to the answer (I > just > haven't been drinking enough Diet Coke lately). There are two good > references which provide additional explanation on dezincification: > Structure and Properties of Engineering Alloys, page 241, ISBN > 0-07-058560-1 (this is a really good general reference on metals as a > subject), and Soldering Handbook, 3rd Edition, ISBN 0-87171-618-6, page > 347. Most folks avoid having dezincification problems by using an > underplate of copper to "seal off" the brass surface from the solder. > > Dave Hillman > Rockwell Collins > [log in to unmask] > > > > > > Guy Ramsey <[log in to unmask]>@ipc.org> on 10/04/2002 08:02:09 AM > > Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please > respond > to Guy Ramsey <[log in to unmask]> > > Sent by: TechNet <[log in to unmask]> > > > To: [log in to unmask] > cc: > > Subject: Re: [TN] soldering brass to copper > > > IPC-HDBK-001 5.1.2 > Brass is an alloy consisting mainly of copper and zinc. Without a > barrier layer of copper or nickel over the brass, the zinc will dissolve > into the molten solder during soldering, Zinc contamination of the > solder joint is evident by a rough, grainy, frosty, porous surface with > a high dendritic structure. Also, solder wetting to the terminal would > be inhibited. > > Wish I knew more, perhaps Dhillman would find time to comment? > > > -----Original Message----- > > From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting > > Sent: Thursday, October 03, 2002 3:23 PM > > To: [log in to unmask] > > Subject: [TN] soldering brass to copper > > > > > > I vaguely remember something about soldering brass in some > > recent posts. We are looking at some cooling parts that may > > require soldering brass to copper. My experience says that > > this is a non-problem. The posts that I remember said > > something about tin and crystallization. Am I mixing two > > different thoughts here? > > > > Phil Nutting > > Manufacturing Engineer > > Kaiser Systems, Inc. > > voice: 978-922-9300 > > e-mail: [log in to unmask] > > > > -------------------------------------------------------------- > > ------------------- > > Technet Mail List provided as a free service by IPC using > > LISTSERV 1.8e To unsubscribe, send a message to > > [log in to unmask] with following text in the BODY (NOT the > > subject field): SIGNOFF Technet To temporarily halt or > > (re-start) delivery of Technet send e-mail to > > [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE > > mailing per day of all the posts: send e-mail to > > [log in to unmask]: SET Technet Digest Search the archives of > > previous posts at: http://listserv.ipc.org/archives Please > > visit IPC web site http://www.ipc.org/html/forum.htm for > > additional information, or contact Keach Sasamori at > > [log in to unmask] or 847-509-9700 ext.5315 > > 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