Hi there, I have some questions & concerns on table 3-6 "Plated-Through Hole Integrity After Stress" of IPC-6012A, particularly on "Hole wall dielectric/plated barrel separation." 1. One of my customer specified "Hole Wall Pullaway" as an acceptable criteria. Is the "Pullaway" same as "Hole wall dielectric/plated barrel separation." in IPC-6012A ? 2. In my opinion, the criteria in each class is addressing for component holes only. How about vias that will not have anything to be filled with? What if the separation is all around the hole wall(of course in double sided)? Would this criteria also be workable for vias in double side PCB's? Let me have your comment on my concern. Thank you very much. Sonny Jee SIMM Tech Co., Ltd. 70-5, Songjong-dong, Heungduk-ku, Chongju Chungchongbuk-do, Korea --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------