Hi there,

I have some questions & concerns on table 3-6 "Plated-Through Hole
Integrity After Stress" of IPC-6012A, particularly on "Hole wall
dielectric/plated barrel separation."

1. One of my customer specified "Hole Wall Pullaway" as an acceptable
criteria. Is the "Pullaway" same as "Hole wall dielectric/plated barrel
separation." in IPC-6012A ?

2. In my opinion, the criteria in each class is addressing for component
holes only. How about vias that will not have anything to be filled with?
What if the separation is all around the hole wall(of course in double
sided)?
Would this criteria also be workable for vias in double side PCB's?

Let me have your comment on my concern.

Thank you very much.

Sonny Jee

SIMM Tech Co., Ltd.
70-5, Songjong-dong, Heungduk-ku, Chongju
Chungchongbuk-do, Korea

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