IPC has a document on surface finishes which is free. Here is the link
http://www.surfacemountcouncil.org/secure/smcwp005.pdf
<http://www.surfacemountcouncil.org/secure/smcwp005.pdf>
Bret
-----Original Message-----
From: Kane, Joseph [mailto:[log in to unmask]]
Sent: Thursday, October 03, 2002 6:27 AM
To: [log in to unmask]
Subject: [TN] Alternative Finishes To Tin/Lead
I'm trying to compile a table of alternative finishes, and
would welcome
comments.
I've seen more discussion about this stuff here than on the
Lead Free forum.
Finish: Tin
Applicablity: PWB's, Component Leads
Advantages: Inexpensive, Solderable
Disadvantages: Risk of tin whiskers
Finish: Silver
Applicablity: PWB's, Component Leads
Advantages: Solderable
Disadvantages: Shelf Life (tarnish), Environmental Issues
Finish: Palladium/Silver
Applicablity: Component Leads
Advantages: Proven History (TI)
Disadvantages: Expensive, Possible palladium embrittlement
Finish: ENIG
Applicablity: PWB's
Advantages: Flat, Solderable, Proven History
Disadvantages: Expensive, Black Pad, Possible gold
embrittlement on small
solder joints
Finish: Gold Over Nickel
Applicablity: Component Leads
Advantages: Solderable, Proven History
Disadvantages: Expensive, Gold must be removed from SMT
components before
soldering
Finish: OSP's
Applicablity: PWB's
Advantages: Inexpensive
Disadvantages: Limited shelf life, Limited reworkability for
misprints
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