Does anyone have experience using TBGAs? I understand that a thermal bond is made between the lands on a ceramic chip and a Copper laminate tape to which is added solder balls on the bottom of the tape to make bond to PWBs. This is supposed to solve the CTE difference problem. What is the nature of the chip bond to tape and how and why does it survive CTE differences? Does anyone out there have thermal cycling data on them and assembly experience with them? --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------