Sorry, the finger hit send too fast. Hi Technos, I just saw a copy of the desk reference manual IPC-DRM-SMT-C, in normal language the Surface Mount Solder Joint Evaluation excerpt from IPC-A-610C. I would need your opinions on the paragraph treating the nonwetting (page 35). The manual shows a fine pitch IC, on ImAu pads, with pretty uniform and well wetted joints, but the solder does not go all the way to cover the whole pad. The tips still show the gold. This is presented as a defect. Is it really a defect? With extra large pads for fine pitch, we all reduce the apertures of the stencils. In this situation, there will not be enough solder to wet all the surface of the pads. What about the homeplated apertures? No way that the chopped corners will be covered with solder. So, I guess you know, there are big issues with the inspection. Please let me know what your experience is with non HASL finishes. Do have the solder covering 100% of the pad after reflow? Thank you, Ioan --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------