Message
Getting the paste isn't too hard. But, reflow (25-40 degrees above liquidous) temperature for those alloys is hazardous for FR-4, and many components. Ceramic chip caps and thick film resistors might be okay but this is clearly over the top for most plastic IC packages. We have done some experimenting with direct attach and forming-gas to ceramic using these alloys. One day we ran an FR-4 board though the oven without thinking. What came out of the oven would best be described as ash with body.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Friday, September 06, 2002 3:20 PM
To: [log in to unmask]
Subject: Re: [TN] High temp pastes for wave soldering...

Hi Steve,

Hope you don't mind, I put a subject in the subject box for your post...

As far as through-put issues with your dispenser, why not print your epoxy. You would do the whole board in well less than 30-seconds, and have much better accuracy and consistency than you could ever expect from a dispenser.

As far as high temperature pastes go, you would need one of the high-lead alloys in order to be above the typical solder pot temperature of 500° F (260° C). Getting these alloys in paste form is going to be challenge as well, you can bet that it's going to be a custom order with a minimum buy too.

A few of those alloys are:

                             ° F            ° C

Sn10Pb90       514 - 576       268 - 302
Sn10Pb88Ag02
514 - 570       268 - 299
Sn05Pb92.5 Ag2.5      536              280

My two-cents...

-Steve Gregory-



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