Is anyone successfully using a high temperature paste to do bottom side SMT reflow, thereby avoiding the glue/cure/wave process?  The reason I ask is that we may be asked to build a board with roughly 1800 bottom side SMT (none topside, mostly 0603s, 0805's, maybe 150 SOIC's from 8-16) with a few hundred top side pth, axial and radial.

It's a long story as to why I would ask this, and it's not something I wish to get into here (suffice it to say that the people that needed to read Earl's book (see, I knew I could fit it in somewhere) didn't, but the long and short of it is I cringe at both the throughput issues with the dispenser (15k/hour) and the yield problems associated with gluing and waving rather than reflowing.  We do NOT have AOI, for what that's worth.

Have a nice weekend, all.....

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