George,
Can
you reference any testing/studies that quantify the bondability of this met.
scheme. What type of Gold bonding was performed, Ball or Wedge? Any
input would be greatly appreciated.
Bill
C.
NorLux
Corp.
I take it
you have your own reasons for applying electroless nickel as the barrier layer
underlying the soft gold layer. Electroless nickel will work just fine for
your application.
Having said that, if your wire bonding sights are
bussed to allow for Gold plating, then they also are bussed for electrolytic
nickel plating, which is gnerally a much less demanding process to run
and maybe accomplished using the same racking just prior to gold plating.
Electroless nickel has traditionally been used where no bussing is
available.
An excellent surface for gold wire bonding is electroless
nickel/electroless palladium /flash gold at 100uins/12uins /1uins (nicroinch)
respectively.
George Milad
HDI Consulting
Chairman IPC Plating
Committee
(516) 901-3874 cell
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