R.J Klein Wassink; Soldering in Elecronics , Chapter 4.2 Section 4.2.5 discusses this topic. ISBN 0 901150 24. We have some trouble getting this book in for classes. But it is the book on the science of soldering. Try the SMTA book store. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ted Edwards Sent: Saturday, September 07, 2002 1:40 PM To: [log in to unmask] Subject: [TN] Copper Tin Intermetallic Growth Rate I have received a question that I need to answer from a customer who is making a long term buy of solder reflowed tin lead finish boards. Plated tin lead seems to read in the .0006 inch range before hot oil reflow on the boards in question. One of the customers concerns is the possibility of growth of the tin lead intermetallics that might in their mind result in an unsolderable condition later. Projected storage is at least 5 years at room temperature. Final assembly when done will probably be RMA flux and wave solder in most cases. Any help would be appreciated. Boards are individually bagged with a desiccant package and humidity indicator strips and heat sealed. I am looking for technical papers, other literature, etc. Werner: I printed out and kept all your TechNet e mails, and in your September 3, 1997 Assembly: Dewetting; you mention a temperature/time dependency, are there charts or other reference materials? Thanks to all: Ted Edwards Process Engineering manager Dynaco Corp. Tempe, AZ. ------------------------------------------------------------------------ --------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ --------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------