Jack, Again, new guy my ass (again meant as a compliment), it is pretty simple depending on how new you are, or me for that matter. It ain't magic, black or otherwise. It is proven stuff. As you have indicated to me VERY CLEARLY you don't need my book. I'm sorry as it puts me to sleep as well. However, most of the answers you seek, concerning this issue and many more, are in it. Also, I work with anyone for free as I have so clearly demonstrated over the years but I can just go so far on this forum and, to cover some minor costs as more that 20 years writing the damn thing, I must charge an amount just cover my dumb ass (not meant as a compliment to me but reality is what it is). I cannot answer even a few questions as is evidenced by my stumbling efforts on this fine forum. However, the folks buying my book, or not, on this forum work concurrently and do a pretty good job, Come on in Jack, Earl ----- Original Message ----- From: "Jack C. Olson" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, September 06, 2002 8:13 AM Subject: Re: [TN] IPC-TM-650-2.6.8, Thermal stress, Plated Through Holes > For those of us new guys who don't know what you're > talking about most of the time <grin> > Is there some underlying principle that can be stated > in a technical way, that some ratio of glass to resin > will result in a more reliable construction? > Or is it more complicated than that? > > Jack (aka "the new guy") > > > >Date: Thu, 5 Sep 2002 14:13:30 -0500 > >From: Earl Moon <[log in to unmask]> > >Subject: Re: IPC-TM-650-2.6.8, Thermal stress, Plated Through Holes > > > > > >Going back many years, we in the MLB business had ILS problems but didn't > >call it that. We knew, that when using very resin rich materials, certain > >forces were exerted diagonally to the trace/pad to conductor interface > >casuing cracking or separation. Most of what I talk about today is > imposing > >requirements using more moderate glass styles and corresponding resin > >contents. <snip> > > -------------------------------------------------------------------------- ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > -------------------------------------------------------------------------- ------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------