Has anyone converted from conventional copper material and oxide process to double treated copper for their multilayer process? If you have, I would appreciated it if you could help me in doing a feasibility study to eliminate our oxide line and how we may need to change or add to our process to suit double treated copper. We are currently using : a) Mechanical brushing to clean the core material (double-side FR4) prior to laminting the etch resist. I read that double-treated copper cannot be scrubbed and is prone to chemical attack. b) We use dry film etch resist. Will D-T copper cause us to change this process? c) Ammonium chloride is the etchant. Thank you in advance for your help. Oliver Yeo Quality Manager IMP Printed Circuits Pty Ltd Tel : 61-8 8262 1444 Fax : 61-8 8262 6004 www.imppc.com.au Attention: This e-mail message is confidential and privileged. Only the intended recipient may access or use it. Any distribution, use, dissemination, reproduction, copying of this e-mail without prior written consent is prohibited. If you are not the intended recipient, please notify us immediately by return e-mail and then erase the e-mail. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------