Hi all!

Got a question, if you were building a high layer count assembly (16-layers @ .063" overall thickness), that has BGA's on both sides, that will see temperatures of -40 C. to +75 C., is there any reason NOT to use FR4?

Having a little debate here, I have a number of reasons why I wouldn't want to use FR4, but just like to hear what you all think...

Thanks in Advance!

-Steve Gregory- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------