Technet,

If I may continue my question on BGA rework process:

Recently we have seen intermitted failures from a few BGA assemblies.
After removing the suspicious BGA on the rework station we noticed
dewetting on a majority number of pads of the removed BGA. The solder
ball residues were mostly attaching to the board.

Has anyone seen this before? How likely can this be caused by a
non-optimum rework removal profile Is baking of the board normal prior
to rework (removal/re-placement)?

We are tackling this issue from the part supplier side and looking at
performing destructive X-ray analysis. Can someone give me an idea of
what the ball attachment process is on the BGA?

Rgds,
Peter

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