Technet, If I may continue my question on BGA rework process: Recently we have seen intermitted failures from a few BGA assemblies. After removing the suspicious BGA on the rework station we noticed dewetting on a majority number of pads of the removed BGA. The solder ball residues were mostly attaching to the board. Has anyone seen this before? How likely can this be caused by a non-optimum rework removal profile Is baking of the board normal prior to rework (removal/re-placement)? We are tackling this issue from the part supplier side and looking at performing destructive X-ray analysis. Can someone give me an idea of what the ball attachment process is on the BGA? Rgds, Peter --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------